(A) Placing an IC in a non-conductive plastic bag
(B) Placing an IC on a grounded mat
(C) Repeated sags in current supplied from outlets
(D) Touching metal on the chassis
(A) Placing an IC in a non-conductive plastic bag
(B) Placing an IC on a grounded mat
(C) Repeated sags in current supplied from outlets
(D) Touching metal on the chassis
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